It is not every day one has the opportunity to explore the inner-workings of an international technology enterprise and witness, first hand, the intricate processes and procedures that combine to create product.
So when the global manufacturer of motherboard chipsets, integrated circuits, embedded microprocessors and flash memory, Intel Corporation, offered a site visit to its semi-conductor wafer fabrication facilities inIreland- IT News Africa responded immediately.
Intel’s FAB 24 and FAB24-2, which operate as FAB24, manufacturing facility in Leixlip, County Kildare, was opened in 2004 and is a key part of the company’s extensive operation in the country. It also has a research facility based in Shannon, County Clare.
In 2009 the company marked the 20thyear of operation inIreland. The FAB operations are focused on research, development and manufacturing, including that of silicon wafer technology.
This technology is used to help produce transistor components that form part of the chipset technology integrated into mobile and digital lifestyle devices.
Intel’s Irish story is one of success, beginning with modest assembly operations in the late 80’s to the emergence of an internationally recognised technology enterprise focused on opportunities in Digital Health, Silicon development, IT innovation, solutions for education and research in nano science.
The company has achieved a number of milestones:-
The territory has served the company well and is considered one of Intel’s flagship sites.
Eamonn Sinnott, Vice President and General Manager, Intel Ireland, said the region offers up a number of advantages for Intel including attractive financial and tax incentives, it forms part of the European Union, there is access to a skilled workforce and ongoing capital investment opportunities.
Intel employs approximately 4 000 people at its Irish operation, covering a number of silos including design, sales, marketing and research.
Mass collaboration, digital transformation and sustainability have been identified as the mega-trends to be exploited, as they continue to impact on machine-to-machine, person-to-machine and person-to-person interaction.
The manufacturing process
Fabrication is the term used to describe the process of making computer chips.
When the company first started with chip production, it used 2-inch-diameter wafers. Today, 12-inch or 300-millimeter wafers are primarily used.
Larger wafers are more difficult to process, but the result is lower cost chip.
Intel uses a photolithographic ‘printing’ process to construct a chip, layer by layer.
Layers are deposited across the wafer and then removed in small areas to develop transistors and interconnects.
These form the active part of the chip’s circuitry as well as the connections between them.
A few interesting points about the business:
Chris Tredger, Online Editor